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substrate(IC chip) - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Mountaineer "S20"

Mountaineer "S20"

The substrate transfer speed is up to 900mm/sec! Introducing a mounter with flexible component/variety compatibility.

The "S20" is a Yamaha-made mounter that enhances substrate compatibility. It features an expansion for 3D MID (three-dimensional molded circuit components) mounting, and it is characterized by its versatility in setup. Additionally, the components that can be mounted include 0201 to 120×90mm BGA, CSP, connectors, and other irregular components (standard 0402 and above). 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced substrate compatibility ■ Flexible component/variety compatibility ■ Versatile setup for general use *For more details, please refer to the related links or feel free to contact us.

  • Mounter

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Mountaineer "S10"

Mountaineer "S10"

Pursuit of versatility in setup! A mounter with flexible parts/model compatibility.

We would like to introduce the YAMAHA manufactured mounter 'S10' handled by Masu Shoji. It has enhanced board compatibility and can be expanded for 3D MID mounting. The board dimensions range from a minimum of L50 x W30mm to a maximum of L1,330 x W510mm (standard L955), with a maximum board transport speed of 900mm/sec. 【Features】 ■ Expansion for 3D MID mounting ■ Enhanced board compatibility ■ Flexible component/variety compatibility ■ Setup designed for versatility *For more details, please refer to the related links or feel free to contact us.

  • Mounter

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MI-PCB Technology

MI-PCB Technology

High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!

"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers. It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more. 【Features】 ■ High Thermal Performance ■ Reduces the thickness of electronic product sets ■ No need for heatsinks ■ Eliminates processes related to heatsink attachment, improving productivity (No need for thermal grease application and eliminates the heatsink attachment process) *For more details, please refer to the PDF document or feel free to contact us.

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